Home > Taconic PCB > Taconic RF-35TC High Frequency PCB With 10mil, 20mil, 30mil and 60mil Thick Coating Immersion Gold and Immersion Silver
Taconic RF-35TC High Frequency PCB With 10mil, 20mil, 30mil and 60mil Thick Coating Immersion Gold and Immersion Silver

(Note: PCBs are custom-made products; images and specifications are for reference only.)


Introduction

Welcome to our overview of the high-frequency PCB constructed with RF-35TC material.


RF-35TC is a PTFE-based, ceramic-filled fiberglass material from Taconic, specifically designed for high-frequency applications.



Key Advantages

Exceptional Thermal Management

This high-performance material provides superior heat dissipation, making it an ideal choice for thermally conductive, low-loss laminates. It excels in high-power applications by efficiently dissipating heat from both the transmission lines on the PCB and surface-mounted components like capacitors.


Furthermore, the dielectric constant (Dk) remains stable over a wide temperature range, enhancing antenna gains and efficiencies. The RF-35TC bonds effectively with low-profile copper, significantly reducing insertion loss.


Main Applications

1. Power Amplifiers: The extremely low dissipation factor (Df) of 0.0011, combined with high thermal conductivity, makes RF-35TC particularly suited for power amplifier applications.

2. Couplers: The low Z-axis coefficient of thermal expansion (CTE) and temperature-stable Dk are critical for both narrow and broadband overlay couplers.


3. Filters:The low X and Y CTE values are essential for maintaining precise distances between trace elements in printed filters:The low X and Y CTE values are essential for maintaining precise distances between trace elements in printed filters.


Additionally, RF-35TC is widely utilized in antennas, satellite equipment, and more.



PCB Capabilities (RF-35TC)

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PCB Material:

PTFE based ceramic filled fiberglass substrate

Designator:

RF-35TC

Dielectric constant      @ 10GHz:

3.50

Layer count:

1 Layer, 2 Layer, Multilayer, Hybrid type

Copper weight:

0.5oz, 1oz, 2oz

PCB thickness:

0.3mm, 0.6mm, 0.8mm, 1.6mm

(10mil, 20mil, 30mil, 60mil substrate)

Solder mask:

Green, Red, Black, White, Blue etc.

PCB size:

≤400mm X 500mm

Surface finish:

Bare copper, HASL, ENIG, Immersion tin etc.


Our company specializes in providing single-sided, double-sided, multilayer, and hybrid PCBs. The most common copper thicknesses are 1oz and 2oz.


We offer a variety of thicknesses, including 0.3mm, 0.6mm, 0.8mm, and 1.6mm, to meet different application needs. Solder mask colors are available in green, red, black, white, and blue.


The maximum PCB size we support is 400mm x 500mm, with various surface finishes available, such as bare copper, hot air leveling (HASL), immersion gold, and immersion tin.The standard colors for RF-35TC PCBs are brown and gray.


Conclusion

Our company focuses on prototypes, small batch production, and mass manufacturing.


For any inquiries, please feel free to contact us.


Thank you for your attention!


Appendix: Data Sheet RF-35TC

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RF-35TC TYPICAL VALUES

Property

Test Method

Unit

Value

Unit

Value

DK @10 GHz

IPC-650 2.5.5.5.1(modified)

 

3.5

 

3.5

Tck(-30 to 120℃)

IPC-650 2.5.5.5.1(modified)

ppm

24

ppm

24

Df @10 GHz

IPC-650 2.5.5.5.1(modified)

 

0.0011

 

0.0011

Dielectric Breakdown

IPC-650 2.5.6(in-Plane,Two Pins in Oil)

kV

56.7

kV

56.7

Dielectric Strength

ASTM D 149(Through Plane)

V/mil

570

V/mm

22,441

Arc Resistance

IPC-650 2.5.1

Seconds

304

Seconds

304

Moisture Absorption

IPC-650 2.6.2.1

%

0.05

%

0.05

Flexural Strength(MD)

ASTM D 790/IPC-650 2.4.4

psi

12,900

N/mm2

88.94

Flexural Strength(CD)

ASTM D 790/IPC-650 2.4.4

psi

11,700

N/mm2

80.67

Tensile Strength(MD)

ASTM D 3039/IPC-TM-650 2.4.19

psi

9,020

N/mm2

62.19

Tensile Strength(CD)

ASTM D 3039/IPC-TM-650 2.4.19

psi

7,740

N/mm2

53.37

Elongation at Break(MD)

ASTM D 3039/IPC-TM-650 2.4.19

%

1.89

N/mm

1.89

Elongation at Break(CD)

ASTM D 3039/IPC-TM-650 2.4.19

%

1.7

%

1.7

Young's Modulus(MD)

ASTM D 3039/IPC-TM-650 2.4.19

psi

667,000

N/mm2

4,599

Young's Modulus(CD)

ASTM D 3039/IPC-TM-650 2.4.19

psi

637,000

N/mm2

4,392

Poisson's Ratio(MD)

ASTM D 3039/IPC-TM-650 2.4.19

 

0.18

 

0.18

Poisson's Ratio(CD)

ASTM D 3039/IPC-TM-650 2.4.19

 

0.23

 

0.18

Compressive Modulus

ASTM D 695(23℃)

psi

560,000

N/mm2

3,861

Flexural Strength(MD)

ASTM D 790/IPC-650 2.4.4

psi

1.46 x 106

N/mm2

10,309

Flexural Strength(CD)

ASTM D 790/IPC-650 2.4.4

psi

1.50 x 1066

N/mm2

10,076

Peel Stength(½ oz.CVH)

IPC-650 2.4.8(Thermal Stress.)

Ibs./inch

7

g/cm33

1.25

Thermal Conductivity(Unclad,125℃)

ASTM F433(Guarded Heat Flow)

W/(mK)

0.6

W/(mK)

0.6

Thermal Conductivity(C1/C1,125℃)

ASTM F433(Guarded Heat Flow)

W/(mK)

0.92

W/(mK)

0.92

Thermal Conductivity(CH/CH,125℃)

ASTM F433(Guarded Heat Flow)

W/(mK)

0.87

W/(mK)

0.87

Dimensional Stability(MD)

IPC-650-2.4.39 Sec.5.4(After Etch)

mils/in.

0.23

mm/M

0.23

Dimensional Stability(CD)

IPC-650-2.4.39 Sec.5.4(After Etch)

mils/in.

0.64

mm/M

0.64

Dimensional Stability(MD)

IPC-650-2.4.39 Sec.5.5(Thermal Stress.)

mils/in.

-0.04

mm/M

-0.04

Dimensional Stability(CD)

IPC-650-2.4.39 Sec.5.5(Thermal Stress.)

mils/in.

0.46

mm/M

0.46

Surface Resistivity

IPC-650 2.5.17.1(after elevated temp.)

Mohms

8.33 x 107

Mohms

8.33 x 107

Surface Resistivity

IPC-650 2.5.17.1(after humidity)

Mohms

6.42 x 107

Mohms

6.42 x 107

Volume Resistivity

IPC-650 2.5.17.1(after elevated temp.)

Mohms/cm

5.19 x 108

Mohms/cm

5.19 x 108

Volume Resistivity

IPC-650 2.5.17.1(after humidity)

Mohms/cm

2.91 x 108

Mohms/cm

2.91 x 108

CTE(X axis)(25-260℃)

IPC-650 2.4.41/ASTM D 3386

ppm/℃

11

ppm/℃

11

CTE(Y axis)(25-260℃)

IPC-650 2.4.41/ASTM D 3386

ppm/℃

13

ppm/℃

13

CTE(Z axis)(25-260℃)

IPC-650 2.4.41/ASTM D 3386

ppm/℃

34

ppm/℃

34

Density

ASTM D 792

g/cm3

2.35

g/cm3

2.35

Hardness

ASTM D 2240(Shore D)

 

79.1

 

79.1

Strain at Break(MD)

ASTM D 790/IPC-650 2.4.4

%

0.014

%

0.014

Strain at Break(CD)

ASTM D 790/IPC-650 2.4.4

%

0.013

%

0.013

Specific Heat

ASTM E 1269-05,E 967-08,E968-02

j/(g℃)

0.94

j/(g℃)

0.94

Td(2% Weight Loss)

IPC-650 2.4.24.6/TGA

oF

788

420

Td(5% Weight Loss)

IPC-650 2.4.24.6/TGA

oF

817

436


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