(Note: PCBs are custom-made products; images and specifications are for reference only.)
Introduction
Welcome to our overview of the high-frequency PCB constructed with RF-35TC material.
RF-35TC is a PTFE-based, ceramic-filled fiberglass material from Taconic, specifically designed for high-frequency applications.
Key Advantages
Exceptional Thermal Management
This high-performance material provides superior heat dissipation, making it an ideal choice for thermally conductive, low-loss laminates. It excels in high-power applications by efficiently dissipating heat from both the transmission lines on the PCB and surface-mounted components like capacitors.
Furthermore, the dielectric constant (Dk) remains stable over a wide temperature range, enhancing antenna gains and efficiencies. The RF-35TC bonds effectively with low-profile copper, significantly reducing insertion loss.
Main Applications
1. Power Amplifiers: The extremely low dissipation factor (Df) of 0.0011, combined with high thermal conductivity, makes RF-35TC particularly suited for power amplifier applications.
2. Couplers: The low Z-axis coefficient of thermal expansion (CTE) and temperature-stable Dk are critical for both narrow and broadband overlay couplers.
3. Filters:The low X and Y CTE values are essential for maintaining precise distances between trace elements in printed filters:The low X and Y CTE values are essential for maintaining precise distances between trace elements in printed filters.
Additionally, RF-35TC is widely utilized in antennas, satellite equipment, and more.
PCB Capabilities (RF-35TC)
PCB Material: |
PTFE based ceramic filled fiberglass substrate |
Designator: |
RF-35TC |
Dielectric constant @ 10GHz: |
3.50 |
Layer count: |
1 Layer, 2 Layer, Multilayer, Hybrid type |
Copper weight: |
0.5oz, 1oz, 2oz |
PCB thickness: |
0.3mm, 0.6mm, 0.8mm, 1.6mm |
(10mil, 20mil, 30mil, 60mil substrate) |
|
Solder mask: |
Green, Red, Black, White, Blue etc. |
PCB size: |
≤400mm X 500mm |
Surface finish: |
Bare copper, HASL, ENIG, Immersion tin etc. |
Our company specializes in providing single-sided, double-sided, multilayer, and hybrid PCBs. The most common copper thicknesses are 1oz and 2oz.
We offer a variety of thicknesses, including 0.3mm, 0.6mm, 0.8mm, and 1.6mm, to meet different application needs. Solder mask colors are available in green, red, black, white, and blue.
The maximum PCB size we support is 400mm x 500mm, with various surface finishes available, such as bare copper, hot air leveling (HASL), immersion gold, and immersion tin.The standard colors for RF-35TC PCBs are brown and gray.
Conclusion
Our company focuses on prototypes, small batch production, and mass manufacturing.
For any inquiries, please feel free to contact us.
Thank you for your attention!
Appendix: Data Sheet RF-35TC
RF-35TC TYPICAL VALUES |
|||||
Property |
Test Method |
Unit |
Value |
Unit |
Value |
DK @10 GHz |
IPC-650 2.5.5.5.1(modified) |
|
3.5 |
|
3.5 |
Tck(-30 to 120℃) |
IPC-650 2.5.5.5.1(modified) |
ppm |
24 |
ppm |
24 |
Df @10 GHz |
IPC-650 2.5.5.5.1(modified) |
|
0.0011 |
|
0.0011 |
Dielectric Breakdown |
IPC-650 2.5.6(in-Plane,Two Pins in Oil) |
kV |
56.7 |
kV |
56.7 |
Dielectric Strength |
ASTM D 149(Through Plane) |
V/mil |
570 |
V/mm |
22,441 |
Arc Resistance |
IPC-650 2.5.1 |
Seconds |
304 |
Seconds |
304 |
Moisture Absorption |
IPC-650 2.6.2.1 |
% |
0.05 |
% |
0.05 |
Flexural Strength(MD) |
ASTM D 790/IPC-650 2.4.4 |
psi |
12,900 |
N/mm2 |
88.94 |
Flexural Strength(CD) |
ASTM D 790/IPC-650 2.4.4 |
psi |
11,700 |
N/mm2 |
80.67 |
Tensile Strength(MD) |
ASTM D 3039/IPC-TM-650 2.4.19 |
psi |
9,020 |
N/mm2 |
62.19 |
Tensile Strength(CD) |
ASTM D 3039/IPC-TM-650 2.4.19 |
psi |
7,740 |
N/mm2 |
53.37 |
Elongation at Break(MD) |
ASTM D 3039/IPC-TM-650 2.4.19 |
% |
1.89 |
N/mm |
1.89 |
Elongation at Break(CD) |
ASTM D 3039/IPC-TM-650 2.4.19 |
% |
1.7 |
% |
1.7 |
Young's Modulus(MD) |
ASTM D 3039/IPC-TM-650 2.4.19 |
psi |
667,000 |
N/mm2 |
4,599 |
Young's Modulus(CD) |
ASTM D 3039/IPC-TM-650 2.4.19 |
psi |
637,000 |
N/mm2 |
4,392 |
Poisson's Ratio(MD) |
ASTM D 3039/IPC-TM-650 2.4.19 |
|
0.18 |
|
0.18 |
Poisson's Ratio(CD) |
ASTM D 3039/IPC-TM-650 2.4.19 |
|
0.23 |
|
0.18 |
Compressive Modulus |
ASTM D 695(23℃) |
psi |
560,000 |
N/mm2 |
3,861 |
Flexural Strength(MD) |
ASTM D 790/IPC-650 2.4.4 |
psi |
1.46 x 106 |
N/mm2 |
10,309 |
Flexural Strength(CD) |
ASTM D 790/IPC-650 2.4.4 |
psi |
1.50 x 1066 |
N/mm2 |
10,076 |
Peel Stength(½ oz.CVH) |
IPC-650 2.4.8(Thermal Stress.) |
Ibs./inch |
7 |
g/cm33 |
1.25 |
Thermal Conductivity(Unclad,125℃) |
ASTM F433(Guarded Heat Flow) |
W/(mK) |
0.6 |
W/(mK) |
0.6 |
Thermal Conductivity(C1/C1,125℃) |
ASTM F433(Guarded Heat Flow) |
W/(mK) |
0.92 |
W/(mK) |
0.92 |
Thermal Conductivity(CH/CH,125℃) |
ASTM F433(Guarded Heat Flow) |
W/(mK) |
0.87 |
W/(mK) |
0.87 |
Dimensional Stability(MD) |
IPC-650-2.4.39 Sec.5.4(After Etch) |
mils/in. |
0.23 |
mm/M |
0.23 |
Dimensional Stability(CD) |
IPC-650-2.4.39 Sec.5.4(After Etch) |
mils/in. |
0.64 |
mm/M |
0.64 |
Dimensional Stability(MD) |
IPC-650-2.4.39 Sec.5.5(Thermal Stress.) |
mils/in. |
-0.04 |
mm/M |
-0.04 |
Dimensional Stability(CD) |
IPC-650-2.4.39 Sec.5.5(Thermal Stress.) |
mils/in. |
0.46 |
mm/M |
0.46 |
Surface Resistivity |
IPC-650 2.5.17.1(after elevated temp.) |
Mohms |
8.33 x 107 |
Mohms |
8.33 x 107 |
Surface Resistivity |
IPC-650 2.5.17.1(after humidity) |
Mohms |
6.42 x 107 |
Mohms |
6.42 x 107 |
Volume Resistivity |
IPC-650 2.5.17.1(after elevated temp.) |
Mohms/cm |
5.19 x 108 |
Mohms/cm |
5.19 x 108 |
Volume Resistivity |
IPC-650 2.5.17.1(after humidity) |
Mohms/cm |
2.91 x 108 |
Mohms/cm |
2.91 x 108 |
CTE(X axis)(25-260℃) |
IPC-650 2.4.41/ASTM D 3386 |
ppm/℃ |
11 |
ppm/℃ |
11 |
CTE(Y axis)(25-260℃) |
IPC-650 2.4.41/ASTM D 3386 |
ppm/℃ |
13 |
ppm/℃ |
13 |
CTE(Z axis)(25-260℃) |
IPC-650 2.4.41/ASTM D 3386 |
ppm/℃ |
34 |
ppm/℃ |
34 |
Density |
ASTM D 792 |
g/cm3 |
2.35 |
g/cm3 |
2.35 |
Hardness |
ASTM D 2240(Shore D) |
|
79.1 |
|
79.1 |
Strain at Break(MD) |
ASTM D 790/IPC-650 2.4.4 |
% |
0.014 |
% |
0.014 |
Strain at Break(CD) |
ASTM D 790/IPC-650 2.4.4 |
% |
0.013 |
% |
0.013 |
Specific Heat |
ASTM E 1269-05,E 967-08,E968-02 |
j/(g℃) |
0.94 |
j/(g℃) |
0.94 |
Td(2% Weight Loss) |
IPC-650 2.4.24.6/TGA |
oF |
788 |
℃ |
420 |
Td(5% Weight Loss) |
IPC-650 2.4.24.6/TGA |
oF |
817 |
℃ |
436 |